About the role
Job Summary We are seeking an expert Senior Process Engineer to focus on process development, characterization, and mass production scale-up for wafer assembly process steps such as back grinding, dicing, laser groove, edge trimming, lamination etc, in our advanced 2.5D/3D packaging research lab. In this technical role, your primary objective will be developing and delivering ultra-thin, high yield, high strength diced dies for 2.5D/3D advanced packaging. Key Responsibilities Responsible for pr…